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  • Home
  • About Us
    • Who We Are
    • Executive Team
    • History
    • Certifications
  • The DSM Diference
    • Why DSM
    • Technology Sophistication
    • Dual-Facility Advantage
    • Cross-Functional Collaboration
    • Tariff Resiliency
  • DSM Services
    • Solutions & Services
    • Manufacturing Capabilities
    • Supply Chain
  • Industries
    • Energy
    • Communications
    • Industrial Automation
    • Automotive
    • Audio & Entertainment
    • Security & Defense
    • Medical
    • Gaming
  • Resources
    • DSM Blog
    • Case Studies
    • Press Releases
    • OEM Handbook: Your Guide to Electronics Manufacturing
    • FAQ
  • Connect
    • Contact Us
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Archives

Monthly Archive for: "January, 2026"
 Layered DFM Reviews: Matching Design Support to Product Risk and Complexity
By Olga Minenkova
In DSM Blog
Posted Jan 27, 2026

Layered DFM Reviews: Matching Design Support to Product Risk and Complexity

As electronics products move from concept to production, design decisions made early in development have a direct impact on cost, quality, reliability, and long-term scalability. Design for [...]

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 Improving Packaging Efficiency and Product Protection with a Custom Reusable ESD Solution
By Olga Minenkova
In Case Studies
Posted Jan 26, 2026

Improving Packaging Efficiency and Product Protection with a Custom Reusable ESD Solution

DSM CASE STUDY Industry: Transportation Electronics Product Type: ESD-Sensitive Electronic Assemblies (PCBA) Services Provided:Custom Reusable Packaging Design, ESD Validation, Logistics [...]

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 Maintaining Production Continuity Through Broker Part Recovery and Component Rectification
By Olga Minenkova
In Case Studies
Posted Jan 21, 2026

Maintaining Production Continuity Through Broker Part Recovery and Component Rectification

DSM CASE STUDY Industry: Electronics and Powersports Systems Product Type: Electronic control modules and performance monitoring assemblies used in motorsports applications Services Provided: [...]

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 Scaling High-Reliability Automotive Electronics with Automated Potting and MES Traceability
By Olga Minenkova
In Case Studies
Posted Jan 20, 2026

Scaling High-Reliability Automotive Electronics with Automated Potting and MES Traceability

DSM CASE STUDY Industry: Automotive Aftermarket Product Type: Performance Electronics Module (potted assembly) Services Provided: NPI support, automation integration, custom tooling, MES [...]

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 Inside the Build: How X-Ray Inspection Protects Product Quality in EMS
By Olga Minenkova
In DSM Blog
Posted Jan 19, 2026

Inside the Build: How X-Ray Inspection Protects Product Quality in EMS

In modern electronics manufacturing, many of the most critical connections are hidden from view. As component packages become smaller and board density increases, visual inspection alone is no [...]

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 Manufacturing Trends for 2026: What OEMs Need to Know
By Olga Minenkova
In DSM Blog
Posted Jan 14, 2026

Manufacturing Trends for 2026: What OEMs Need to Know

As global manufacturing enters 2026, industry leaders face a pivotal moment shaped by economic data, technology shifts, supply chain pressures, and the evolving semiconductor landscape. For OEMs, [...]

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 How Humidity Control Protects PCB Quality and Long-Term Reliability
By Olga Minenkova
In DSM Blog
Posted Jan 12, 2026

How Humidity Control Protects PCB Quality and Long-Term Reliability

In electronics manufacturing, quality does not start on the production line. It starts with the environment. Temperature and humidity play a critical role in how printed circuit boards (PCBs), [...]

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 How to Scale High-Mix, High-Volume Production with Smart Automation
By Olga Minenkova
In DSM Blog
Posted Jan 5, 2026

How to Scale High-Mix, High-Volume Production with Smart Automation

High-mix, high-volume manufacturing comes with a unique set of challenges. Products change frequently, volumes can grow quickly, and expectations around quality, cost, and delivery remain high. [...]

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We acknowledge that in Calgary we operate on Treaty 7 territory, traditional lands of the Blackfoot Confederacy, Tsuut’ina Nation, Stoney Nakoda Nations, and the Métis Nation of Alberta, Region III, and that our Tempe operations are on the traditional lands of the Akimel O’odham (Pima) people.


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