DSM Manufacturing Capabilities

DSM manufacturing capabilities cover the full spectrum of EMS from material management and traceability with automated storage and UID tracking, to high-speed SMT and PCB assembly with advanced inspection systems, to post-soldering, manual assembly, and final box builds. We also provide specialized cleaning and conformal coating, backed by robust process traceability, MES integration, and engineering support.

Material Management & Level 4 Traceability

  • To strengthen process reliability from the very start, DSM relies on the JUKI Incoming Station for material receiving. This enhances traceability and ensures accuracy before production begins.
  • Once materials arrive, each is assigned a Unique Identifier (UID). This allows for dynamic storage and better organization; as a result, inventory management is more accurate and efficient.
  • For component reels, the Nordson DAGE X-ray system provides real-time counting. By instantly updating the material management system, we maintain precise quantities and reduce errors.
  • Efficiency in handling is achieved with large-capacity JUKI Storage Towers, which automate material storage and job kit picking. This streamlines operations and improves floor space utilization.
  • Finally, the Cogiscan System ties everything together by linking each reel UID directly to the reference designator of a serialized PCBA. The outcome is complete Level 4 traceability at the component level, giving customers full confidence in product integrity.
Material Management & Level 4 Traceability Yuki Tower
Material Management & Level 4 Traceability Yuki Tower
Surface Mount Technology (SMT) Assembly & Inspection Koh Young
Surface Mount Technology (SMT) Assembly & Inspection Koh Young

Surface Mount Technology (SMT) Assembly & Inspection

  • To ensure accurate PCB setup, ASYS ERKA solder paste screen printers use automated pin support placement. With under-stencil cleaning and post-inspection, even the smallest stencil apertures consistently meet cleanliness standards.
  • For boards that require additional solder or glue on pads, GPD Precision Dispense complements the screen-printing process. This ensures reliable adhesion and structural integrity for specialized builds.
  • Quality is reinforced through Koh Young Solder Paste Inspection (SPI) systems, which verify alignment (X, Y, rotation) and solder volume. As a result, every printed PCB meets strict specifications before moving forward.
  • Flexibility is built into production with four versatile ASMPT SMT lines, capable of handling everything from small NPI batches to medium- and high-volume runs.
  • With advanced ASMPT placement technology, we can handle components from ultra-small 01005 chips (0.4mm × 0.2mm) and fine-pitch devices down to 0.4mm, all the way up to parts as large as 200mm × 125mm and 25mm in height. Each line delivers more than 50,000 component placements per hour (CPH), ensuring both speed and precision.
  • Thermal challenges are addressed with Heller 9-zone convection ovens, designed for precise solder reflow on complex builds with more than 20 layers.
  • To guarantee accuracy, MIRTEC 3D Automated Optical Inspection (AOI) examines every board. This ensures component placement and soldering meet IPC requirements.
  • For hidden or bottom-terminated parts, the Nordson DAGE 3D X-ray system confirms that BGAs, QFNs, and similar components are free of defects.

Post Secondary Soldering, Manual Assembly & Test

  • To handle products with a high number of through-hole (TH) components or large build volumes, we rely on the Electrovert Wave Pb-Free Soldering machine. This ensures consistency, speed, and quality even in demanding production runs.
  • When thermal challenges or tight TH-to-SMT spacing make soldering complex, two ERSA Selective Solder Machines (SSM) provide precise, reliable results. As a result, boards with intricate layouts are assembled without risk of damage.
  • For assemblies that require a human touch, our IPC-A-610 certified staff bring expertise in soldering and mechanical assembly. From simple builds to complex enclosures, their skill ensures products meet the highest workmanship standards.
  • To close the loop, our Test Engineering team supports and sustains customer in-house test setups. With optional AEGIS MES integration, we can track failures and record First Pass Yield (FPY) data in real time giving customers valuable insights for continuous improvement.
Post Secondary Soldering, Manual Assembly & Test
Post Secondary Soldering, Manual Assembly & Test
PCB Cleaning & Conformal Coating Methods
PCB Cleaning & Conformal Coating Methods

PCB Cleaning & Conformal Coating Methods

  • To meet customer-specified cleanliness standards, we use the Aqueous Technology PCB Batch Cleaning System. This process ensures boards are free from contaminants and ready for high-reliability applications.
  • For protective coatings, an automated COBOT work-cell handles conformal coat dipping. The result is a tightly controlled and repeatable process that delivers consistent coverage across every board.
  • Precision is further enhanced by our PVA 5-axis Conformal Coating Spray system, which applies coatings accurately while reducing the masking required in keep-out areas.
  • To support speed and flexibility, in-house 3D printing technology allows us to produce custom masking solutions quickly and cost-effectively, reducing lead times for complex projects.

Manufacturing Process Traceability & Engineering Value-Adds

  • To maintain visibility across production, we use the AEGIS Manufacturing Execution System (MES) to track the status of serialized products in real time. By collecting data at multiple points, we strengthen process control, improve defect tracking, and generate detailed yield reporting and analysis.
  • To ensure designs are ready for efficient production, DSM Engineering conducts Design for Manufacturing (DFM) reviews before fabrication, as well as during and after the first assembly build. This proactive approach helps prevent costly issues and shortens time to market.
  • Collaboration is built into our process. By working closely with customers’ technical teams, we make sure every product and manufacturing requirement is clearly defined, aligned, and executed with precision.
Manufacturing Process Traceability & Engineering Value-Adds
Manufacturing Process Traceability & Engineering Value-Adds

Partner with a Trusted North American Electronics Manufacturer

   

Our dual-facility model, with mirrored operations in Calgary, AB, and Tempe, AZ, ensures consistency, resilience, and flexibility for customers across North America and beyond. With state-of-the-art equipment, Lean processes, and Industry 4.0 innovations, we deliver the quality and efficiency needed to bring even the most complex products to market.

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